詳細信息
產品培訓模塊:
Board-to-Board Connectors
產品目錄繪圖: TSW Series Dual
標準包裝:1
系列:TSW
包裝:散裝
觸頭類型:公形引腳
連接器類型:接頭,無罩
針腳數:90
加載的針腳數:全部
間距:0.100"(2.54mm)
排數:2
排距:0.100"(2.54mm)
觸頭配接長度:0.230"(5.84mm)
安裝類型:通孔
端接:焊接
緊固類型:-
特性:-
觸頭鍍層:金
觸頭鍍層厚度:30µin(0.76µm)
顏色:黑
配套產品:SAM1223-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1221-45-ND - CONN RCPT .100" 90POS DUAL TIN
SAM1218-45-ND - CONN RCPT .100" 90PS DL R/A GOLD
SAM1217-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1215-45-ND - CONN RCPT .100" 90PS DL R/A GOLD
SAM1214-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1212-45-ND - CONN RCPT .100" 90POS DUAL TIN
SAM1210-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1208-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1205-45-ND - CONN RCPT .100" 90POS DL R/A TIN
更多...
產品目錄繪圖: TSW Series Dual
標準包裝:1
系列:TSW
包裝:散裝
觸頭類型:公形引腳
連接器類型:接頭,無罩
針腳數:90
加載的針腳數:全部
間距:0.100"(2.54mm)
排數:2
排距:0.100"(2.54mm)
觸頭配接長度:0.230"(5.84mm)
安裝類型:通孔
端接:焊接
緊固類型:-
特性:-
觸頭鍍層:金
觸頭鍍層厚度:30µin(0.76µm)
顏色:黑
配套產品:SAM1223-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1221-45-ND - CONN RCPT .100" 90POS DUAL TIN
SAM1218-45-ND - CONN RCPT .100" 90PS DL R/A GOLD
SAM1217-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1215-45-ND - CONN RCPT .100" 90PS DL R/A GOLD
SAM1214-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1212-45-ND - CONN RCPT .100" 90POS DUAL TIN
SAM1210-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1208-45-ND - CONN RCPT .100" 90POS DUAL GOLD
SAM1205-45-ND - CONN RCPT .100" 90POS DL R/A TIN
更多...
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TSW-145-08-S-D-RASamtecInc代理分銷2023+全新進口原裝現貨品質保證
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TSW-145-08-S-DSamtecInc代理分銷2023+1250全新進口原裝現貨品質保證